R&D Services to Develop an Improved Isolation Technology Radiation Hardened Bipolar Integrated Circuits (PEDIC)

摘要

This report describes work performed in the development of a dielectrically isolated integrated circuit process for fabricating radiation hardened integrated circuits. The improved process, called PEDIC (Post Epitaxial Dielectrically Isolated Circuits), provides advantages over standard DI processes: radiation tolerant improvements, lower cost, faster turnaround time, better electrical performance, and greater packing density. Electrical test data from a 2-input NAND gate circuit fabricated in the PEDIC structure is also given. (Author)