Wafer-Scale Digital Integrator Using Restructurable (Very Large Scale Integration)

摘要

Wafer-scale integration has been demonstrated by fabricating a digital integrator on a monolithic 20-sq cm silicon chip, the first laser-restructured digital logic system. Large-area integration is accomplished by laser programming of metal interconnect for defect avoidance. This paper describes the technology for laser welding and cutting, the design methodology and CAD tools developed for wafer-scale integration, and the integrator itself. (Reprints)