Wafer-scale integration using restructurable VLSI

摘要

Results from a restructurable very large scale integration (RVLSI) program show the viability of using a laser to restructure wafer-scale circuits for customization and defect avoidance. Wafer-scale circuits are built with a standard integrated circuit fabrication process when the diffused-link restructuring device is used. Nine wafer-scale systems that have been built using the RVLSI technique are described. It is shown that the laser interconnection process has high yield and provides the high reliability of monolithic circuitry. The technology is well suited to signal processing systems, which characteristically use many replications of a small number of circuits and often have modest interconnection requirements.