Mechanical Properties of Microelectronics Thin Films: Silicon Dioxide (SiO2).

摘要

Mechanical design of microfabricated devices requires knowledge of mechanical material properties. Thin film material properties are sensitively process dependent, and should therefore be organized accordingly. A relational database of material properties is under development as part of a general micro-electro-mechanical CAD environment. A computerized literature search through the published values for Silicon Dioxide (SiO2) properties under various processing conditions resulted in the following document. (r.h.)