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Investigation of asymmetric effects due to gate misalignment, gate bias and underlap length in III-V heterostructure underlap DG MOSFET

机译:研究III-V型异质结构下叠式DG MOSFET中由于栅极未对准,栅极偏置和下叠长度引起的不对称效应

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In the present work, we investigate the influence of asymmetry in III-V heterostructure underlap DG MOSFET caused by back gate movement, back gate voltages and drain side underlap length. The device has narrowband In_(0.53)Ga_(0.47)As and wideband InP layers in the channel, along with high-K A1203 as the gate dielectric. The 2D Sentaurus TCAD simulations are done using drift diffusion model and interface traps are considered. The simulation model is calibrated with the previous reported experimental results. For the same gate misalignment value, back gate shift toward drain (BG_D) resulted in a lower DIBL, loff and Delay, than back gate shift towards source (BG_S). Conversely, BG_S results in lower SS, higher on and Ion//loff ratio. Excellent threshold voltage controllability, reduced delay, reduced energy delay product, higher Ion//loff ratio are achieved by varying back gate voltage. Varying drain underlap reduces DIBL, SS, Delay, loff and increases Vt and Ion/loff ratio. Thus, application specific optimized device parameters can be achieved with asymmetrical device structure, asymmetrical gate bias or its combination.
机译:在目前的工作中,我们研究了背栅移动,背栅电压和漏极侧下重叠长度对III-V型异质结构下重叠DG MOSFET不对称的影响。该器件在通道中具有窄带In_(0.53)Ga_(0.47)As和宽带InP层,以及高K A1203作为栅极电介质。使用漂移扩散模型完成了二维Sentaurus TCAD仿真,并考虑了界面陷阱。仿真模型已根据先前报告的实验结果进行了校准。对于相同的栅极失准值,向栅极的背向漏极的偏移(BG_D)导致的DIBL,Ioff和Delay小于向栅极的向源极的背偏移(BG_S)。相反,BG_S导致较低的SS,较高的on和Ion // loff比。通过改变背栅电压可以实现出色的阈值电压可控性,减少的延迟,减少的能量延迟乘积,更高的Ion // loff比。漏极漏斗的变化可降低DIBL,SS,延迟,Ioff并增加Vt和Ion / Ioff比。因此,可以通过不对称的器件结构,不对称的栅极偏置或其组合来实现专用的优化器件参数。

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