首页> 外国专利> GERMANIUM TRANSISTOR STRUCTURE WITH UNDERLAP TIP TO REDUCE GATE INDUCED BARRIER LOWERING/SHORT CHANNEL EFFECT WHILE MINIMIZING IMPACT ON DRIVE CURRENT

GERMANIUM TRANSISTOR STRUCTURE WITH UNDERLAP TIP TO REDUCE GATE INDUCED BARRIER LOWERING/SHORT CHANNEL EFFECT WHILE MINIMIZING IMPACT ON DRIVE CURRENT

机译:带有欠压尖的锗晶体管结构,可减小对驱动电流的最小影响而产生的栅诱导的栅栏变窄/缩短通道效应

摘要

An apparatus including a transistor device including a channel disposed on a substrate between a source and a drain, a gate electrode disposed on the channel, wherein the channel includes a length dimension between source and drain that is greater than a length dimension of the gate electrode such that there is a passivated underlap between an edge of the gate electrode and an edge of the channel relative to each of the source and the drain. A method including forming a channel of a transistor device on a substrate; forming first and second passivation layers on a surface of substrate on opposite sides of the channel; forming a gate stack on the channel between first and second passivation layers; and forming a source on the substrate between the channel and the first passivation layer and a drain on the substrate between the channel and the second passivation layer.
机译:一种设备,包括:晶体管器件,其包括:沟道,其布置在源极和漏极之间的基板上;栅电极,其布置在所述沟道上,其中,所述沟道的源极和漏极之间的长度尺寸大于所述栅电极的长度尺寸。因此,相对于源极和漏极中的每一个,在栅电极的边缘和沟道的边缘之间存在钝化的重叠。一种方法,包括在衬底上形成晶体管器件的沟道;以及在通道的相对侧上的衬底表面上形成第一和第二钝化层;在第一和第二钝化层之间的沟道上形成栅堆叠;在沟道和第一钝化层之间的基板上形成源极,在沟道和第二钝化层之间的基板上形成漏极。

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