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Effect of AlN buffer layer on the growth of InN epitaxial film on Si substrate

机译:AlN缓冲层对Si衬底上InN外延膜生长的影响

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InN films were grown on Si(111) substrates by RF-MBE, and an AIN buffer layer was inserted between Si substrates and a low-temperature InN buffer layer. The AIN buffer layer suppressed the formation of amorphous-like SiNx layer on the Si substrate surface, which led to the improvement of the crystallinity of the low-temperature InN buffer layer. High-quality InN films could then be realized on the low-temperature InN buffer layer with the AIN buffer layer inserted. The best value of the XRC-FWHM was 31.3 arcmin for InN films with a thickness of 300 nm. In addition, a surface reconstruction of InN was observed for the first time. (C) 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. [References: 14]
机译:通过RF-MBE在Si(111)衬底上生长InN膜,并且将AIN缓冲层插入在Si衬底与低温InN缓冲层之间。 AIN缓冲层抑制了在Si衬底表面上形成非晶状SiNx层,这导致低温InN缓冲层的结晶性提高。然后可以在插入了AIN缓冲层的低温InN缓冲层上实现高质量的InN膜。对于厚度为300 nm的InN薄膜,XRC-FWHM的最佳值为31.3 arcmin。另外,首次观察到InN的表面重建。 (C)2003 WILEY-VCH Verlag GmbH&Co.KGaA,Weinheim。 [参考:14]

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