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Zirconium nitride/aluminum nitride buffer layers for epitaxial growth of (indium,gallium) nitride on silicon substrates.

机译:氮化锆/氮化铝缓冲层,用于在硅基板上外延生长(铟,镓)氮化物。

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摘要

An integral back contact and reflector is demonstrated as an epitaxial template to seed GaN growth on silicon. ZrN was chosen as the ideal candidate material to act as the integral back contact and reflecting layer. ZrN is lattice matched to 14% InN in (In,Ga)N, is a refractory material (Tmelt ∼ 2960°C), and has a high reflectivity in the blue-green portion of the visual spectrum. An additional AlN layer is added to the layer stack to prevent an interfacial reaction between the ZrN and Si as well as to provide electrical isolation of a device.;From an industrial standpoint, (In,Ga)N growth on silicon substrates would alleviate the cost constraints of the current LED fabrication technology by allowing for a reduction in costly production steps (laser lift-off, packaging), greater scalability (300mm wafers), reduced wafer cost over sapphire (or SiC), and reduced series resistance by removing current crowding in the final device. The addition of a reflecting layer increases the light emission by reflecting light from the silicon substrate that would otherwise absorb it.;This work addresses the issues of substrate processing and film growth from the Si(111) substrate up to (In,Ga)N film growth. A ZrN/AlN bilayer stack is deposited by reactive magnetron sputtering to buffer (In,Ga)N growth on Si(111). The addition of the AlN layer was found to prevent detrimental chemical reactions at process temperatures (T= ∼1000°C) between the ZrN and Si layers, while improving the epitaxial growth of ZrN. GaN and (In, Ga)N were deposited by organometallic vapor phase epitaxy on these ZrN/AlN substrates and produced films with a o-rocking curve full width at half maximum (FWHM) value of 1230 arc sec for a 800nm film of c-plane oriented GaN (FWHM about GaN 0002 reflection). Although the aim of this research was initially aimed at providing a growth substrate for templated nanorod growth, it also has implications far beyond that specific application, as the GaN-based device industry continues to grow.
机译:集成的背触点和反射器被演示为外延模板,用于在硅上生长GaN。 ZrN被选为理想的候选材料,可作为整体的背面接触和反射层。 ZrN与(In,Ga)N中的14%InN晶格匹配,是一种耐火材料(Tmelt〜2960°C),并且在可见光谱的蓝绿色部分具有高反射率。在层堆叠中添加了一个额外的AlN层,以防止ZrN和Si之间的界面反应以及提供器件的电隔离。;从工业角度来看,硅衬底上(In,Ga)N的生长会减轻通过减少昂贵的生产步骤(激光剥离,封装),更大的可扩展性(300mm晶圆),与蓝宝石(或SiC)相比降低了晶圆成本以及通过消除电流而降低了串联电阻,从而限制了当前LED制造技术的成本挤在最后的设备上。反射层的添加通过反射来自硅基板的光而增加了光的发射,否则该硅基板会吸收该光。;这项工作解决了从Si(111)基板到(In,Ga)N的基板处理和膜生长的问题电影成长。通过反应磁控溅射沉积ZrN / AlN双层堆栈,以缓冲(In,Ga)N在Si(111)上的生长。发现添加AlN层可以防止在ZrN和Si层之间的工艺温度(T =〜1000℃)下有害的化学反应,同时改善ZrN的外延生长。在这些ZrN / AlN衬底上通过有机金属气相外延沉积GaN和(In,Ga)N,并制成800 nm c-膜的O-摇摆曲线半峰全宽(FWHM)值为1230弧秒的膜。平面取向GaN(关于GaN 0002反射的FWHM)。尽管此研究的目的最初旨在为模板化的纳米棒生长提供生长基质,但随着基于GaN的器件行业的不断发展,其意义也远远超出了特定的应用范围。

著录项

  • 作者

    Oliver, Mark H.;

  • 作者单位

    Purdue University.;

  • 授予单位 Purdue University.;
  • 学科 Engineering Materials Science.
  • 学位 M.S.M.S.E.
  • 年度 2008
  • 页码 105 p.
  • 总页数 105
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 11:38:36

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