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Control of acceptor doping in MOCVD HgCdTe epilayers

机译:MOCVD HgCdTe外延层中受体掺杂的控制

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The acceptor doping of mercury cadmium telluride (HgCdTe) layers grown by MOCVD are investigated. (111 )HgCdTe layers were grown on (100)GaAs substrates at 350℃ using horizontal reactor and interdiffused multilayer process (IMP). TDMAAs and AsH3 were alternatively used as effective p-type doping precursors. Incorporation and activation rates of arsenic have been studied. Over a wide range of Hg_(1-x)Cd_xTe compositions (0.17 < x < 0.4), arsenic doping concentration in the range from 5 x10~(15) cm~(-3) to 5 x10~(17) cm~(-3) was obtained without postgrowth annealing. The electrical and chemical properties of epitaxial layers are specified by measurements of SIMS profiles, Hall effect and minority carrier lifetimes. It is confirmed that the Auger-7 mechanism has decisive influence on carrier lifetime in p-type HgCdTe epilayers.
机译:研究了通过MOCVD生长的碲化汞镉(HgCdTe)层的受体掺杂。使用水平反应器和互扩散多层工艺(IMP)在350℃下在(100)GaAs衬底上生长(111)HgCdTe层。 TDMAAs和AsH3被交替用作有效的p型掺杂前体。已经研究了砷的掺入和活化速率。在宽范围的Hg_(1-x)Cd_xTe组成(0.17

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