Thanks to their reliability in harsh environments - for example, with high ambient temperatures, rapid temperature changes, high acceleration rates, high vibration loads - as well as the possibility of realizing high integration densities, LTCC circuits remain irreplaceable in automotive electronics. In telecommunications too, there is a demand for the miniaturization of components and circuitry, especially for RF management. As the market is demanding additional functions, but is only prepared to accept higher costs for a short time, the possibility of cost reduction must already be taken into consideration in the development of new materials. The sintering process accounts for an important share of the cost of manufacturing LTCC circuits. Here the design of a robust process is an advantage.
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