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Structuration of zero-shrinkage LTCC using mineral sacrificial materials

机译:使用矿物牺牲材料的零收缩LTCC的结构

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Recently, LTCC (low-temperature co-fired ceramic) technology has increasingly found applications beyond pure electronics, in fields such as microfluidics, sensors and actuators, due to the ease of shaping the tapes in the green (unfired) state. Accurate control of hollow structures such as channels, membranes, cavities and gaps below cantilevers has remained difficult, however, although carbon-based sacrificial materials and adhesive/solvent-assisted low-pressure lamination techniques are adequate for several uses. Mineral sacrificial pastes (MSP), introduced by several groups including our laboratory, allow in principle much better control of open structures such as bridges and cantilevers, as they are removed only after the firing step. In practice, accurate dimensional control has been limited by deformation of the LTCC during sintering, due to shrinkage mismatch with the MSP. Attempts to eliminate this problem have met with limited success, as it is very difficult to perfectly match the shrinkage curve of the MSP (which must retain open porosity) to that of the LTCC substrate. Therefore, in this work, we endeavour to investigate MSP materials on self-constraining "zero-shrinkage" LTCC tape, which is therefore compatible with a low degree of sintering of the MSP. We present results of optimising the MSP formulation accordingly, to achieve reasonable consolidation, low deformation of LTCC and easy removal in weak acid solutions. Important topics such organic vehicle formulation and complete release processes (etching, rinsing and drying) of thin structures are also addressed.
机译:最近,LTCC(低温共烧陶瓷)技术已经越来越多地发现超出纯电子应用,在诸如微流体,传感器和致动器,由于易于在绿色(未击发)状态成形带。中空结构,例如通道,膜,腔和下面的悬臂间隙的精确控制仍然困难的,但是,虽然基于碳的牺牲材料和粘合剂/溶剂辅助低压层压技术是足够的几种用途。矿产牺牲膏(MSP),通过几组包括我们实验室引进,允许开放式结构,如桥梁和悬臂的原则,更好的控制,因为它们只在烧成工序后取出。在实践中,精确的尺寸控制已经烧结,由于与MSP收缩失配时限制由LTCC的变形。试图消除这个问题获得了有限的成功,因为它是非常难以完全匹配到LTCC基板的MSP的收缩曲线(其必须保持开放孔隙率)。因此,在本工作中,我们努力探讨自约束“零收缩” LTCC带,其因此具有低程度的MSP烧结的兼容MSP材料。因此,我们优化了MSP制定的目前的结果,实现合理整合,LTCC的低变形,易拆卸在弱酸性溶液。重要课题这样的有机载体制剂和完全释放过程(蚀刻,清洗和干燥)薄膜结构还解决。

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