CMOS integrated tactile sensor array by porous Si bulk micromachining

摘要

An integrated 8 x 8 element 3D force sensor array was developed for tactile sensing. The 300 x 300 mu m(2) sensors are formed from monocrystalline silicon membranes with spacing of 700 mu m. The signals of the individual transducers are read out line-by-line via an on-chip CMOS decoder. The porous silicon bulk micromachining was implemented as one of the final steps of the n-well CMOS compatible processing. (C) 2007 Elsevier B.V. All rights reserved.