首页> 外文期刊>Russian Journal of Inorganic Chemistry >Effect of the content of hydrogen fluoride in an etchant on the formation of nanopores in silicon during electrolytic etching
【24h】

Effect of the content of hydrogen fluoride in an etchant on the formation of nanopores in silicon during electrolytic etching

机译:蚀刻剂中氟化氢含量对电解蚀刻过程中硅中纳米孔形成的影响

获取原文
获取原文并翻译 | 示例

摘要

The effect of the HF content on the formation of nanopores in silicon during electrochemical etching was studied. Nanoporous silicon layers were established to be formed only when hydrogen fluoride content in etchants (initial HF content: 49 wt %) was higher than 10-12 vol %. The mass and charge balance of the electrolytic etching of silicon was calculated, and the change in charge number of reaction (effective silicon valence) was determined depending on the HF content. The obtained data were used to propose a silicon etching model with the formation of SiF4 and nanoporous silicon (where nanopores were formed due to the action of predominantly (HF2)(-) ions).
机译:研究了HF含量对电化学刻蚀过程中硅中纳米孔形成的影响。只有当蚀刻剂中的氟化氢含量(初始HF含量:49 wt%)高于10至12 vol%时,才能形成纳米多孔硅层。计算硅的电解蚀刻的质量和电荷平衡,并根据HF含量确定反应的电荷数的变化(有效硅价)。所获得的数据被用于提出具有SiF4和纳米多孔硅(其中主要由于(HF2)(-)离子的作用而形成纳米孔)的硅蚀刻模型。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号