首页> 外文期刊>Modern Physics Letters, B. Condensed Matter Physics, Statistical Physics, Applied Physics >INFLUENCE OF CONTINUOUS AND DISCONTINUOUSDEPOSITIONS ON PROPERTIES OF ITO FILMS PREPAREDBY DC MAGNETRON SPUTTERING
【24h】

INFLUENCE OF CONTINUOUS AND DISCONTINUOUSDEPOSITIONS ON PROPERTIES OF ITO FILMS PREPAREDBY DC MAGNETRON SPUTTERING

机译:连续和不连续沉积对直流磁控溅射制备ITO薄膜性能的影响

获取原文
获取原文并翻译 | 示例
           

摘要

Indium tin oxide (ITO) films were deposited on glass substrate without external heatingby DC magnetron sputtering with continuous deposition of 800 s (S1) and discontinuousdepositions of 400 s x 2 times (S2), 200 s x 4 times (S3) and 100 s x 8 times (S4). Thestructural, surface morphology, optical transmittance and electrical resistivity of ITOfilms were measured by X-ray diffraction, atomic force microscope, spectrophotometerand four-point probe, respectively. The deposition process of the S1 condition shows thehighest target voltage due to more target poisoning occurrence. The substrate temper-ature of the S1 condition increases with the saturation curve of the RC charging circuitwhile other conditions increase and decrease due to deposition steps as DC power turnson and off. Target voltage and substrate temperature of ITO films decrease when chang-ing the deposition conditions from S1 to S2, S3 and S4, respectively. The preferentialorientation of ITO films were changed from dominate (222) plane to (400) plane withthe increasing number of deposition steps. The ITO film for the S4 condition shows thelowest electrical resistivity of 1.44 x 10-3 Ω.cm with the highest energy gap of 4.09 eVand the highest surface roughness of 3.43 nm. These results were discussed from thepoint of different oxygen occurring on the surface ITO target between the sputteringprocesses which affected the properties of ITO films.
机译:通过直流磁控溅射在不进行外部加热的情况下将氧化铟锡(ITO)膜沉积在玻璃基板上,连续沉积800 s(S1),不连续沉积400 sx 2倍(S2),200 sx 4倍(S3)和100 sx 8倍(S4)。用X射线衍射,原子力显微镜,分光光度计和四点探针分别测量了ITO膜的结构,表面形貌,透光率和电阻率。由于更多的目标中毒事件,S1条件的沉积过程显示出最高的目标电压。 S1条件下的基板温度随RC充电电路的饱和曲线而增加,而其他条件则由于沉积步骤(随着DC电源的关闭和关闭)而增加和减少。当将沉积条件分别从S1更改为S2,S3和S4时,ITO膜的目标电压和衬底温度会降低。随着沉积步骤数量的增加,ITO薄膜的优先取向从主(222)面变为(400)面。在S4条件下的ITO膜显示最低的电阻率为1.44 x 10-3Ω.cm,最大能隙为4.09 eV,最大表面粗糙度为3.43 nm。从影响ITO膜性能的溅射工艺之间,在表面ITO靶材上产生不同的氧的角度讨论了这些结果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号