DIELECTRIC THICKNESS AND GROUND WIDTH EFFECT ON MULTILAYER COPLANAR COMPONENTS AND CIRCUITS FOR CERAMIC MULTICHIP MODULES

摘要

This article investigates the effect of dielectric thickness and ground width on the performance of multilayer conductor backed coplanar waveguide lumped elements and circuits fabricated on advanced multilayer photoimageable thick-film ceramic multichip module (MCM) technology. From the S-parameters, the effective dielectric constant is extracted to investigate the effect of dielectric thickness and ground-width on transmission line dispersion. The equivalent circuit parameters for multilayer ceramic-based capacitors and inductors are investigated for various dielectric thicknesses and ground-plane widths. Finally, the practical effect of dielectric thickness and ground width are investigated for a highly compact and high performance lumped element low pass filter at 3 GHz, developed for cost-effective MCM applications.