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Microfabrication and characterization of UV micropatternable, electrically conducting polyaniline photoresist blends for MEMS applications

机译:用于MEMS应用的可紫​​外微图案化的导电聚苯胺光致抗蚀剂共混物的微细加工和表征

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We present the preparation and electrical characterization of an electrically conductive blend of polyaniline (PANi) and SU-8 UV micropatternable photoresist that offers promising opportunities for MEMS applications. The blend was prepared by shear mixing of PANi and SU-8 2010 resist at an rpm of 1,000 for 15 h. The composite was spin-coated on a silicon wafer at an 850 rpm in order to achieve a thickness of 50 A mu m, followed by soft baking at 70 A degrees C for 35 min and cooling to room temperature. The desired structures were patterned using masked UV exposure for 60 s. Full cross-linking of PANi and SU-8 blend was achieved by a post-exposure bake at a temperature of 90 A degrees C for 25 min, followed by cooling to room temperature. The desired electrode structures and trace lines were then developed in SU-8 developer for 10 min by manual agitation. The fabricated structures were characterized under Scanning Electron Microscope and through Electron Dispersion X-ray Spectroscopy (EDS) demonstrating that good patternability was achieved when using photo-initiator (triarylsulfonium hexafluoro-anitimonate salts) and gamma-butyrolactone solvents in the blend. Further, electrical characterization together with EDS showed that an electrically conductive path is formed in the PANI SU-8 2010 polymer matrix. It is also observed that resistivity as low as 350 a"broken vertical bar-m was achieved at 8.6 wt% of PANi in SU-8 2010 polymer matrix.
机译:我们介绍了聚苯胺(PANi)和SU-8 UV可微图案化光致抗蚀剂的导电共混物的制备和电学表征,这为MEMS应用提供了广阔的机遇。通过将PANi和SU-8 2010抗蚀剂在1,000 rpm的转速下剪切混合15 h来制备共混物。将复合材料以850 rpm的速度旋涂在硅片上,以达到50 Aμm的厚度,然后在70 A的温度下软烘烤35分钟,然后冷却至室温。使用遮罩的紫外线曝光60 s对所需的结构进行构图。 PANi和SU-8共混物的完全交联是通过在90 A的温度下进行25分钟的曝光后烘烤,然后冷却至室温来实现的。然后通过手动搅拌在SU-8显影剂中显影所需的电极结构和迹线10分钟。所制造的结构在扫描电子显微镜下和通过电子弥散X射线光谱(EDS)进行了表征,证明在共混物中使用光引发剂(三芳基六氟磺酸盐)和γ-丁内酯溶剂时,可获得良好的可图案化性。此外,电学特征与EDS一起表明在PANI SU-8 2010聚合物基体中形成了导电路径。还观察到,在SU-8 2010聚合物基质中,在8.6wt%的PANi下,电阻率低至350a”垂直断线-m。

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