Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

摘要

The long-term reliability of a Ag nanoporous bonding joint for high temperature die attach under temperature cycling from -55 degrees C to 150 degrees C was investigated. A Ag nanoporous sheet was adopted as a bonding layer for the die attach of a Si chip on an active metal brazed Cu Si3N4 substrate, The initial joint strength was similar to that with Pb-5Sn die attach. There was no significant change in the joint strength after temperature cycling up to 1500 cycles. It was possible to confirm that the shear strength of the Ag nanoporous bonding joint had good stability under temperature cycling.