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Processing and Packaging: Manufacturing from a Total Systems Approach: October's pack expo to Offer Solutions Across the Production Line

机译:加工和包装:从整体系统制造方法:10月的包装博览会,为整个生产线提供解决方案

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摘要

With a sunnier economic forecast on the horizon, brand owners will continue to seek ways to reduce manufacturing costs, streamline production and achieve operational excellence to ensure solid business performance. As part of this effort, consumer packaged goods companies (CPGs), including private label manufacturers, are focusing on a total systems approach where processing and packaging elements are intertwined, rather than treated as stand-alone processes. At this year's PACK EXPO International (Oct. 31 - Nov. 3; McCormick Place, Chicago, IL, USA), brand owners can gain greater insight into the interdependence of processing and packaging to enhance operational efficiencies, speed new product commercialization and grow brand sales. Occupying morethan 1 million net square feet, PACK EXPO will bring together more than 1,600 exhibitors and 45,000 attendees from across the globe in the single largest packaging and processing event of the year.
机译:随着即将出现更乐观的经济预测,品牌所有者将继续寻求降低制造成本,简化生产并实现卓越运营的方法,以确保稳健的业务绩效。作为这项工作的一部分,包括自有品牌制造商在内的消费品包装公司(CPG)专注于将加工和包装元素交织在一起而不是被视为独立过程的整体系统方法。在今年的PACK EXPO International(10月31日至11月3日;美国伊利诺伊州芝加哥的麦考密克广场)上,品牌所有者可以深入了解加工与包装的相互依赖关系,以提高运营效率,加快新产品的商业化并壮大品牌销售。 PACK EXPO占地超过100万净平方英尺,在一年中最大的包装和加工活动中,将汇集来自全球的1,600多家参展商和45,000名与会者。

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