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Impact of doped microcrystalline silicon oxide layers on crystalline silicon surface passivation

机译:掺杂的微晶硅氧化物层对晶体硅表面钝化的影响

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This paper reports on a comparative study of the impact of phosphorous and boron doped microcrystalline silicon oxide (μc-SiO_x:H) layers on the surface passivation of n- and p-type doped crystalline silicon float zone wafers in correlation with the material properties of the μc-SiO_x:H layers. The poor surface passivation of μc-SiO_x:H films deposited directly on c-Si surface might be attributed to the incorporation of doping impurities, the surface damaging by ion bombardment and (or) the low amount of hydrogen at the μc-SiO_x:H/c-Si interface. The different impact of n- and p-type doped μc-SiO_x:H films on the passivation of n- and p-type doped wafers with and without an additional a-SiO_x:H passivation layer are correlated to the differences in the strength of the field effect at the heterojunction and to the presence of boron atoms that can cause the rupture of Si-H bonds.
机译:本文报道了磷和硼掺杂的微晶硅氧化物(μc-SiO_x:H)层对n型和p型掺杂的晶体硅浮区晶片的表面钝化及其材料特性的影响的比较研究。 μc-SiO_x:H层。直接沉积在c-Si表面上的μc-SiO_x:H膜的表面钝化差可能归因于掺杂杂质的掺入,离子轰击对表面的破坏和(或)μc-SiO_x:H处的氢含量低/ c-Si接口。 n型和p型掺杂的μc-SiO_x:H膜对带有和不带有附加a-SiO_x:H钝化层的n型和p型掺杂晶片的钝化的不同影响与强度的差异有关异质结处的电场效应以及可能导致Si-H键断裂的硼原子的存在。

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