Lead-free SMT soldering defects - how to prevent them

摘要

The change from 63/37 eutectic to lead-free solder need not increase defects provided the new process is understood, This paper examines the reflow process and the characteristics of different solders and fluxes, and their effects on common defects like solder slump, solder balling, solder bridging, wetting and dewetting, and voids.