Raised copper contact technologies for IC packaging - a path to improved reliability

摘要

Interconnections are arguably the most critical element in electronic system design, and deservedly they are presently getting much greater attention than they have had in the past. Interconnections are found at every level from the chip to the system, and they are also normally the weak link. Nearly every electronic failure can be traced to a point of interconnection. Most commonly, the failure is found in a solder joint, and such failures have been on the rise since the legislatively forced adoption of lead-free solder based on the EU's well intended but completely misguided RoHS legislation. One of the good things that comes with every problem is the opportunity learn and hopefully to make things better. In that regard, the EU's lead-free mandate has proven to be a treasure trove of learning opportunities, and there have been some clever responses to the technical challenges that have accompanied its introduction.