The challenge today is to develop a selective electroless nickel with immersion gold plating process

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The challenge today is to develop a selective electroless nickel with immersion gold plating process

机译：当今的挑战是通过浸金电镀工艺开发选择性化学镍

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《Electronic Packaging and Production》 |1998年第7期|共1页
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1. The challenge today is to develop a selective electroless nickel with immersion gold plating process [J] . Electronic Packaging and Production Group Electronic Packaging and Production . 1998,第7期

机译：当今的挑战是通过浸金电镀工艺开发选择性化学镍
2. Eectroless Plating Processes: Developing Technologies for Electroless Nickel, Palladium, and Gold [J] . Don Baudrand, Jon Bengston Metal Finishing . 1995,第9期

机译：无电镀工艺：化学镀镍，钯和金的开发技术
3. Effects of organic additives on the immersion gold depositing from a sulfite-thiosulfate solution in an electroless nickel immersion gold process [J] . Wang Yao, Liu Haiping, Bi Sifu, RSC Advances . 2016,第12期

机译：有机添加剂对硫酸硫酸盐 - 硫代硫酸盐溶液沉积金属镍浸渍金工艺的影响
4. ELECTROLESS NICKEL / ELECTROLESS PALLADIUM / IMMERSION GOLD PLATING PROCESS FOR GOLD- AND ALUMINUM-WIRE BONDING DESIGNED FOR HIGH-TEMPERATURE APPLICATIONS [C] . Kuldip Johal, Sven Lamprecht, Hugh Roberts Pan Pacific Microelectronics Symposium . 2004

机译：专为高温应用设计的用于金和铝线焊接的化学镍/化学钯/浸金工艺
5. Silicon carbide/electroless nickel composite plating for aluminum substrates. [D] . Charbit, Ben. 1993

机译：铝基板的碳化硅/化学镍复合镀层。
6. Preparation of nickel/PA12 composite particles by defect-induced electroless plating for use in SLS processing [O] . Chengmei Gui, Zhenming Chen, Chenguang Yao, -1

机译：通过缺陷诱导化学镀制备用于SLS工艺的镍/ PA12复合颗粒
7. Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures [O] . Fischer, Andreas C., Lapisa, Martin, Roxhed, Niclas, 2010

机译：在氧等离子体激活的金晶种层上进行选择性化学镀镍，以制造低接触电阻的通孔和微结构

The challenge today is to develop a selective electroless nickel with immersion gold plating process

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