ELECTROLESS NICKEL IMMERSION GOLD PLATING METHOD USING CONDUCTIVE NANO-POLYMER

摘要

The present invention relates to an electroless nickel immersion gold plating method using a conductive nano-polymer. In particular, the electroless nickel immersion gold plating method comprises: a chemical preparing process of putting gold plating additives (hereinafter, called ″GCAT″) using a conductive nano-polymer and potassium gold cyanide (hereinafter, call ″PGC″) in a plating bath for electroless nickel immersion gold at a one to one ratio and stirring the GCAT and the PGC, such that Au concentration is kept within a management range of 0.15 to 0.25 g/L based on the target thickness of a gold plated layer which is 0.3 to 0.7 um; an electroless nickel immersion gold plating process of putting a panel in the plating bath and depositing the panel in the plating bath for a predetermined period to plate the panel with gold after the chemical preparing process; and a concentration keeping process of putting the GCAT and the PGC in the plating bath at a one to one ratio and stirring the GCAT and the PGC, such that Au concentration is kept within a management range of 0.15 to 0.25 g/L based on the target thickness of a gold plated layer which is 0.3 to 0.7 um, thereby reducing consumption of the PGC and increasing utilization.;COPYRIGHT KIPO 2014