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Room Temperature Photoluminescence Characterization of Low Dose As+ Implanted Si after Rapid Thermal Annealing

机译:快速热退火后低剂量砷离子注入硅的室温光致发光特性

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Arsenic (As+ 150 keV, 1.0 x 10(13) cm(-2)) implanted p -Si(100) wafers were spike annealed at 1100 degrees C for 1s in a commercially available rapid thermal annealing (RTA) system. Significant variations in sheet resistance were observed while As dopant profiles, measured by secondary ion mass spectroscopy (SIMS), were almost identical. Photoluminescence (PL) spectra were measured from all wafers under three different excitation wavelengths (532, 650 and 827 nm) at room temperature. PL spectra showed large intensity variation, corresponding to the sheet resistance. PL excitation wavelength dependence suggests the variation in density of residual damage as the possible cause of sheet resistance variation. (c) The Author(s) 2015. Published by ECS. All rights reserved.
机译:将砷(As + 150 keV,1.0 x 10(13)cm(-2))植入的p -Si(100)晶圆在市售的快速热退火(RTA)系统中在1100摄氏度下进行尖峰退火1s。观察到薄层电阻的显着变化,而通过二次离子质谱(SIMS)测量的As掺杂分布几乎相同。在室温下,在三种不同的激发波长(532、650和827 nm)下,从所有晶片测量了光致发光(PL)光谱。 PL光谱显示出大的强度变化,对应于薄层电阻。 PL激发波长的依赖性表明残余损伤密度的变化是薄层电阻变化的可能原因。 (c)2015年作者。ECS发布。版权所有。

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