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首页> 外文期刊>ECS Journal of Solid State Science and Technology >Thick 4H-SiC Epitaxial Growth and Defect Reduction for Very High Voltage Bipolar Devices
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Thick 4H-SiC Epitaxial Growth and Defect Reduction for Very High Voltage Bipolar Devices

机译:超高压双极器件的厚4H-SiC外延生长和缺陷减少

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摘要

The reduction of extended and point defects, including 8H in-grown stacking faults, basal plane dislocations (BPDs), and Z+(1/2) center, in 4H-SiC epitaxial layers was investigated. In the epitaxial growth process, a high density of 8H stacking faults was evaluated in the epilayer grown under a relatively high partial pressure of SiH_4. By decreasing the SiH_4 partial pressure or adding HC1 to the conventional gas system (H_2+SiH_4+C_3H_8), the 8H stacking fault density was considerably reduced. By using 4° off-cut 4H-SiC substrates instead of an 8° off-cut one, an extremely low BPD density in the epilayer was achieved. No deep levels other than Z_(1/2) and EH_(6/7) centers were detected in the upper half of the bandgap for epilayers grown with the addition of HCl. The Z_(1/2) center concentration was reduced to <1 × 10~(12) cm~(-3) by tuning the growth parameters, and further reduced by the post-growth processes.
机译:研究了在4H-SiC外延层中扩展缺陷和点缺陷的减少,包括8H向内生长的堆垛层错,基面位错(BPD)和Z +(1/2)中心。在外延生长过程中,评估了在较高SiH_4分压下生长的外延层中8H堆垛层错的高密度。通过降低SiH_4的分压或向传统的气体系统(H_2 + SiH_4 + C_3H_8)添加HCl,可大大降低8H堆垛层错密度。通过使用4°切角的4H-SiC衬底代替8°切角的衬底,在外延层中实现了极低的BPD密度。在带隙的上半部中未检测到除Z_(1/2)和EH_(6/7)中心以外的其他深层,这些外延层是通过添加HCl生长的。通过调节生长参数将Z_(1/2)中心浓度降低至<1×10〜(12)cm〜(-3),并通过后生长过程进一步降低。

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