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Influence of negative bias voltage on microstructure and property of Al-Ti-N films deposited by multi-arc ion plating

机译:负偏压对多电弧离子电镀沉积的Al-Ti-N膜微观结构和性能的影响

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摘要

In this study, we systematically investigated the effects of negative bias voltage on the composition, deposition efficiency, microstructure, and mechanical properties of multi-arc ion plated (MAIP) AlTiN films. The films were deposited on high-speed steel substrates by MAIP at various negative bias voltages. The results indicated that the Al content [A1/(Al+Ti) ratio] and the deposition efficiency were significantly altered by the application of negative bias voltages. X-ray photoelectron spectroscopy analysis showed that the AITiN films were composed of Ti-N and Al-N bonds. The macroparticles (MPs) on the film surface decreased with increasing negative bias voltage. We also discussed the different types of MPs found on the films and their influence on the process of determining the hardness of the films. The microhardness of the films depends on the negative bias voltages. The films deposited at -250 V exhibited a maximum hardness of similar to 45 GPa. The adhesion and frictional tests revealed that the film deposited at -150 V demonstrated the highest cracking resistance, the best adhesion under a critical load of 78 N, highest adhesion strength, and the lowest and stablest coefficient of friction at 0.23.
机译:在这项研究中,我们系统地研究了负偏压对多电弧离子镀(MAIP)ALTIN膜的组成,沉积效率,微观结构和机械性能的影响。通过MAIP在各种负偏置电压下沉积在高速钢基板上的薄膜。结果表明,通过施加负偏置电压,Al含量[A1 /(Al + Ti)比]和沉积效率显着改变。 X射线光电子能谱分析表明,Aitin膜由Ti-N和Al-N键组成。膜表面上的宏颗粒(MPS)随着负偏置电压的增加而降低。我们还讨论了在电影上发现的不同类型的MPS及其对确定薄膜硬度的过程的影响。膜的显微硬度取决于负偏置电压。沉积在-250V的薄膜表现出类似于45GPa的最大硬度。粘附和摩擦试验显示,在-150V下沉积的薄膜显示出最高的裂化性,在78N,最高粘附强度的临界负载下的最佳粘合性,以及0.23的最低摩擦系数。

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