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GaN lasers on GaAs substrates using laser lift-off technique

机译:使用激光剥离技术GaAs基板上的GaN激光

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摘要

GaN-based LDs with GaAs support were fabricated by separating the nitrides form the sapphire substrate using laser lift-off (LLO)technique. The threshold current and the threshold voltage were 78mA and 6.4V, respectively. Excellent mirror facets with high process yields were achieved due to cleavage on the GaAs substrates. The simulations gave the result that the thermal conductivity increases by bonding GaN side to the stem directly. The thermal resistance of 21°C/W was achieved in LDs using LLO technique.
机译:通过使用激光剥离(LLO)技术将氮化物与蓝宝石衬底分离形成GaAs载体的GaN的LD。 阈值电流和阈值电压分别为78mA和6.4V。 由于在GaAs基材上切割而实现具有高工艺产量的优异镜面。 模拟使得通过直接将GaN侧粘合到杆中,导热率增加。 使用LLO技术在LDS中实现21℃/ w的热阻。

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