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机译:真空包装工业MEMS中挤压膜阻尼的数值模拟与验证
Khalifa Univ Sci &
Technol Masdar Inst Abu Dhabi U Arab Emirates;
Khalifa Univ Sci &
Technol Masdar Inst Abu Dhabi U Arab Emirates;
Khalifa Univ Sci &
Technol Masdar Inst Abu Dhabi U Arab Emirates;
Khalifa Univ Sci &
Technol Masdar Inst Abu Dhabi U Arab Emirates;
Khalifa Univ Sci &
Technol Masdar Inst Abu Dhabi U Arab Emirates;
Inst Microelect Singapore Singapore;
Inst Microelect Singapore Singapore;
GLOBALFOUNDRIES Singapore Singapore;
Khalifa Univ Sci &
Technol Masdar Inst Abu Dhabi U Arab Emirates;
MEMS; squeezed-film damping; vacuum-packaging; FEM; MEMS magnetometer; MEMS process variations;
机译:真空包装工业MEMS中挤压膜阻尼的数值模拟与验证
机译:MEMS中的近真空气体阻尼:数值建模和实验验证
机译:穿孔金和硅MEMS板中空气阻尼的建模和验证
机译:MEMS中使用的稀土气挤压膜阻尼模型的实验验证
机译:MEMS应用倒装芯片焊点几何形状的数值预测和实验验证
机译:Mn-Cu阻尼合金本构方程的修正分数麦克斯韦数值模型
机译:RF MEMS谐振器中挤压膜阻尼的数值和紧凑建模
机译:mEms中粘性阻尼的行为建模