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首页> 外文期刊>Journal of Low Power Electronics >Optimization of FinFET-Based Gain Cells for Low Power Sub-VT Embedded DRAMs
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Optimization of FinFET-Based Gain Cells for Low Power Sub-VT Embedded DRAMs

机译:低功率子v t 嵌入式DRAM的优化基于FinFET的增益单元

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摘要

Sub-threshold circuits (sub-V _(T)) are a promising alternative in the implementation of low power electronics. The implementation of gain-cell embedded DRAMs (eDRAMs) based on FinFET devices requires a careful design to achieve the maximum cell performance (i.e., retentiontime, access time, and energy consumption) suitable for the sub-V _(T) operating level. In this work, we show that asymmetrically resizing the memory cell (i.e., the channel length of the write access transistor and the width of the rest of the devices) results in a 3.5×increase in retention time when compared to the nominal case while reducing area, as well. In terms of reliability (e.g., variability and soft errors), the resizing also improves the cell robustness (50% and 1.9×, respectively) when the cells are operated at sub-V _(T)level.
机译:子阈值电路(子 - v _(t))是实施低功率电子设备的有希望的替代方案。 基于FinFET设备的增益单元嵌入式DRAM(EDRAMS)的实施需要仔细设计,以实现适合于子 - v _(t)的最大单元性能(即,保留时间,访问时间和能量消耗) 运营水平。 在这项工作中,我们表明,与名义情况相比,与额定案例相比,与额定案例相比,与在减少的标称外壳相比,不对称地调整存储器单元(即,写入晶体管的频道长度以及设备的其余部分的宽度)导致保留时间的增加3.5倍。 区域也是如此。 在可靠性(例如,变异性和软误差)方面,当细胞在子 -

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