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首页> 外文期刊>Trends in Ecology & Evolution >A modified low voltage triggered silicon controlled rectifier (SCR) for ESD applications
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A modified low voltage triggered silicon controlled rectifier (SCR) for ESD applications

机译:用于ESD应用的改进的低压触发硅控制整流器(SCR)

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摘要

In this paper, a modified low voltage triggered silicon-controlled rectifier (MLVTSCR) with low trigger voltage and high holding voltage has been proposed and implemented in both 28 nm CMOS process and 0.18 mu m CMOS process. By segmenting the N+ active area bridged on the PW/NW junction of LVTSCR into blocks by P+ region, MLSCR was integrated into LVTSCR. The p(+) blocks and the n(+) blocks are alternately arranged and aligned in the same strip, in this way the proposed MLVTSCR is implemented. Without any extra mask as well as auxiliary trigger component, the proposed MLVTSCR possesses a very low trigger voltage and an adjustable high holding voltage from 2.05 to 4.29 V in 28 nm CMOS process and from 3.32 to 7.3 V in 0.18 mu m BCD process under the TLP test, making it a superior candidate for electrostatic discharge protection in the 3.3 V/5 V CMOS processes. TCAD simulations has also been carried out to explore the intrinsic physical mechanisms of the proposed devices.
机译:在本文中,已经提出了具有低触发电压和高保持电压的改进的低压触发硅控制整流器(MLVTSCR),并在28 nm CMOS工艺和0.18μmCCOS过程中实现。 通过将LVTSCR的PW / NW结桥接的N +有源区域分段通过P +区分割,MLSCR被整合到LVTSCR中。 P(+)块和N(+)块交替地布置并在同一条带中对齐,以这种方式实现了所提出的MLVTSCR。 如果没有任何额外的掩模以及辅助触发分量,所提出的MLVTSCR在28 nm CMOS工艺中具有非常低的触发电压和可调节的高保持电压,在28 nm CMOS工艺中,在0.18 mu m BCD过程中为3.32至7.3V。 TLP测试,使其成为3.3 V / 5 V CMOS工艺中的静电放电保护的优越候选者。 还已经开展了TCAD模拟,以探索所提出的设备的内在物理机制。

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