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首页> 外文期刊>IEEE Transactions on Electron Devices >An Improved Silicon-Controlled Rectifier (SCR) for Low-Voltage ESD Application
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An Improved Silicon-Controlled Rectifier (SCR) for Low-Voltage ESD Application

机译:用于低压ESD应用的改进的硅控制整流器(SCR)

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摘要

In this article, an improved silicon-controlled rectifier (SCR) for low-voltage (LV) electrostatic discharge (ESD) applications has been presented. By employing an N/P-ESD diode and optimizing the SCR layout, both the triggering and current-discharging paths of the new SCR become much shorter than the prior arts, thus generating better clamping ability, faster turn-on speed, and lower overshoot voltage. As a result, the human body model (HBM) robustness increases by 19, 46, and 267 for the proposed device with one, two, and three stacking units, respectively, and the charged-device model (CDM) robustness and turn-on speed of the improved device increase by 80 and 27, respectively, over its conventional counterpart. Furthermore, the contradiction between quasi-static triggering characteristics and transient overshoot voltage frequent in current-assisted triggering of ESD devices has been investigated, where the common method to optimize the trigger voltage by increasing the resistance of triggering path will deteriorate the overshoot characteristics hugely. To make the ESD devices satisfy the emerging higher CDM protection requirement, a tradeoff between the quasi-static trigger voltage and the transient overshoot voltage should be made elaborately.
机译:在本文中,已经提出了一种改进的低压(LV)静电放电(ESD)应用的硅控制整流器(SCR)。通过采用N / P-ESD二极管并优化SCR布局,新SCR的触发和电流放电路径都比现有技术更短,从而产生更好的钳位能力,更快的开启速度,更低的过冲电压。结果,人体模型(HBM)稳健性分别为具有一个,两个和三个堆叠单元的所提出的装置的19,46和267增加,以及带电设备模型(CDM)鲁棒性和开启改进的装置的速度分别在其传统的对应上分别增加80和27。此外,已经研究了对电流辅助触发电流辅助触发的准静电触发特性和瞬态过冲电压之间的矛盾,其中通过增加触发路径的电阻来优化触发电压的常见方法将使过冲特性大大。为了使ESD设备满足新出现的更高CDM保护要求,应制作准静电电压和瞬态过冲电压之间的折衷。

著录项

  • 来源
    《IEEE Transactions on Electron Devices》 |2020年第2期|576-581|共6页
  • 作者单位

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Univ Elect Sci & Technol China State Key Lab Elect Thin Films & Integrated Devic Chengdu 610054 Peoples R China;

    Shenzhen Univ Coll Elect & Informat Engn Shenzhen 518060 Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Charged-device model (CDM); electrostatic discharge (ESD); overshoot voltage; silicon-controlled rectifier (SCR);

    机译:充电设备型号(CDM);静电放电(ESD);过冲电压;硅控制整流器(SCR);

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