首页> 外文期刊>Wear: an International Journal on the Science and Technology of Friction, Lubrication and Wear >Reprint of 'Tribological behavior of monocrystalline silicon from single- to multiple-asperity scratch''
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Reprint of 'Tribological behavior of monocrystalline silicon from single- to multiple-asperity scratch''

机译:重印“单晶硅的摩擦学行为从单一到多元植物划痕”

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摘要

During producing silicon surface and fabricating silicon devices, the machining, cutting and milling from nanoscale to macroscale are accomplished with friction and wear under single- and multiple-asperity contact. In the present study, the scratch tests on silicon surface under single- and multiple-asperity contact were contrastively investigated, and the transition and correlation between different contact modes were addressed. When surface wear (formation of groove or protrusive hillock) appears under single-asperity sliding on silicon, the friction force became load-controlled and increased linearly with the normal load. The transition of single-asperity to multiple-asperity scratch was observed with the increase in the applied normal force. Under the multiple-asperity condition, surface hillocks were created on the scratched area, which were detected only under single-asperity test before. This study will shed new light on the understanding of multi-scale processing of silicon surface, and provide new insight for enriching tribology theory.
机译:在生产硅表面和制造硅装置期间,通过单个和多粗糙接触下的摩擦和磨损完成从纳米级到Macroscale的加工,切割和研磨。在本研究中,对单个和多粗糙接触下的硅表面上的划痕试验被控制地研究,并且解决了不同接触模式之间的转变和相关性。当表面磨损(凹槽或突出的Hillock)在硅上的单粗糙度滑动下出现时,摩擦力变为负载控制并随着正常负载线性增加。随着施加的正常力的增加,观察到单齿性对多粗糙划痕的转变。在多粗糙条件下,在划痕区域上产生表面小丘,仅在单齿性测试中检测到之前。本研究将对硅表面的多尺度加工的理解揭示了新的光线,并为丰富摩擦学理论提供了新的洞察力。

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