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Method for Controlling the Polarity of Gallium Nitride Layers in Epitaxial Synthesis of GaN/AlN Heterostructures on Hybrid SiC/Si Substrates

机译:杂交SiC / Si衬底上GaN / AlN异质结构外延合成中氮化镓层极性的方法

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The effect of the inversion of polarity in gallium nitride layers from the N-polar GaN layer to the Ga-polar GaN layer was discovered during the sequential growth of GaN films on hybrid SiC/Si(111) substrates by nitrogen plasma-assisted molecular beam epitaxy and chloride-hydride vapor phase epitaxy. A new method has been developed for the formation of crack-free Ga-polar GaN/AlN heterostructures on hybrid SiC/Si(111) substrates. The method includes two stages of growing gallium nitride layers. At the first stage, the transient N-polar GaN layer is grown on the SiC/Si(111) surface by nitrogen plasma-assisted molecular beam epitaxy. At the second stage, two layers are grown on the obtained N-polar GaN layer by chloride-hydride vapor phase epitaxy, namely, the AlN layer and then the GaN layer, which at this stage grows in the Ga-polar orientation. Etching in a KOH solution affects only the N-polar GaN transition layer and leads to its complete removal. This procedure separates the main Ga-polar GaN layer from the SiC/Si(111) substrate completely. The method enables one to grow crack-free and elastically unstressed thick GaN layers and transfer them to substrates of other materials.
机译:在通过氮等离子体辅助分子束上的GaN薄膜上的GaN膜的顺序生长期间发现了从N极GaN层到Ga极性GaN层的氮化镓层中氮化镓层中的效果。外延和氯化物 - 氢化物气相外延。已经开发了一种新方法,用于在杂合SiC / Si(111)衬底上形成无裂缝的GA极性GaN / AlN异质结构。该方法包括生长氮化镓层的两个阶段。在第一阶段,通过氮等离子体辅助分子束外延在SiC / Si(111)表面上生长瞬态N极GaN层。在第二阶段,通过氯化物 - 氢化物气相外延,即AlN层和GaN层在获得的N极GaN层上生长两层,其在该阶段在Ga-极性取向上生长。在KOH溶液中蚀刻仅影响N-极性GaN过渡层并导致其完全除去。该过程完全将主GA极性GaN层与SiC / Si(111)衬底分开。该方法使得能够在无裂缝和弹性地防止厚GaN层中生长并将其转移到其他材料的基板上。

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