Influence of firing profile on microstructural and dielectric properties of LTCC substrates

Pietrikova Alena; Rovensky Tibor; Durisin Juraj; Vehec Igor; Kovac Ondrej

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Influence of firing profile on microstructural and dielectric properties of LTCC substrates

机译：烧制曲线对LTCC基板微结构和介电性能的影响

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Purpose - The purpose of this paper is to analyse the influence of various firing profiles on microstructural and dielectric properties of low-temperature, co-fired ceramic (LTCC) substrates in a GHz frequency range. According these analyses, sintering process can be controlled and modified to achieve better performance of devices fabricated from LTCC substrates.

机译：目的 - 本文的目的是分析各种烧制曲线对GHz频率范围内低温，共烧陶瓷（LTCC）基板的微观结构和介电性能的影响。根据这些分析，可以控制和修改烧结过程以实现由LTCC基板制造的装置的更好性能。

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来源
《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 |2017年第3期|共4页
作者
Pietrikova Alena; Rovensky Tibor; Durisin Juraj; Vehec Igor; Kovac Ondrej;
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作者单位

Tech Univ Kosice Dept Technol Elect Kosice Slovakia;

Tech Univ Kosice Dept Technol Elect Kosice Slovakia;

Tech Univ Kosice Dept Technol Elect Kosice Slovakia;

Tech Univ Kosice Dept Technol Elect Kosice Slovakia;

Tech Univ Kosice Dept Technol Elect Kosice Slovakia;

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原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
Microstructure; LTCC; Dielectric properties; Firing profile;

机译：微观结构;LTCC;介电性质;射击型材;

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专利

1. Influence of firing profile on microstructural and dielectric properties of LTCC substrates [J] . Pietrikova Alena, Rovensky Tibor, Durisin Juraj, Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 2017,第3期

机译：烧制曲线对LTCC基板微结构和介电性能的影响
2. Low-firing and microwave dielectric properties of a novel glass-free MoO_3-based dielectric ceramic for LTCC applications [J] . Shu Guojin, Yang Fan, Hao Liang, Journal of materials science . 2019,第8期

机译：用于LTCC应用的新型无玻璃MoO_3基介电陶瓷的低烧结和微波介电特性
3. Microwave dielectric properties of low-temperature-fired MgNb(2)O(6)ceramics for LTCC applications [J] . Wu Chenghao, Hu Yongda, Bao Shengxiang, RSC Advances . 2020,第50期

机译：用于LTCC应用的低温烧制MGNB（2）O（6）陶瓷的微波介电性能
4. Influence of accelerating ageing on LTCC and PCB substrates' dielectric properties in GHz area [C] . Tibor Rovensky, Alena Pietrikova, Ondrej Kovac, International Spring Seminar on Electronics Technology . 2016

机译：加速老化对GHz区域内LTCC和PCB基板介电性能的影响
5. Radio Frequency Characterization and Modelling of Low Temperature Co-Fired Ceramic (LTCC) Material and Devices. [D] . Kalantari, Fatemeh. 2014

机译：低温共烧陶瓷（LTCC）材料和设备的射频特性和建模。
6. Influence of Firing Temperature on the Physical Thermal and Microstructural Properties of Kankara Kaolin Clay: A Preliminary Investigation [O] . Muazu Abubakar, Ayyankalai Muthuraja, Dipen Kumar Rajak, 2020

机译：烧成温度对Kankara高岭土黏土物理热和微观结构性质的影响：初步研究
7. Microwave dielectric properties of low-temperature-fired MgNb2O6 ceramics for LTCC applications [O] . Chenghao Wu, Yongda Hu, Shengxiang Bao, 2020

机译：用于LTCC应用的低温烧制MgNB2O6陶瓷的微波介电性能
8. Analysis of the Pull Strength Behaviors of Fine-Pitch, Flip Chip Solder Interconnections Using a Au-Pt-Pd Thick Film Conductor on Low-Temperature, Co-Fired Ceramic (LTCC) Substrates [R] . Vianco, P. T., Rejent, J. A., Grazier, J. M., 2008

机译：利用au-pt-pd厚膜导体在低温共烧陶瓷（LTCC）基板上分析细间距，倒装芯片焊料互连的拉伸强度行为

Influence of firing profile on microstructural and dielectric properties of LTCC substrates

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