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Sensitivity enhancement and temperature compatibility of graphene piezoresistive MEMS pressure sensor

机译:石墨烯压阻MEMS压力传感器的灵敏度增强和温度兼容性

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摘要

MEMS pressure sensor has shown a remarkable change in revenue collection during the year 2018. Due to recent growth in smart microsystem technology for automation systems, demand has grown substantially for sensors. High sensitivity, flexibility, miniaturization and bulk production are some of the key factors of a pressure sensor in achieving new heights in the MEMS market. In this paper, Graphene piezo resistive material has been analysed for pressure sensing elements and compared with Polysilicon in terms of sensitivity and sensor performance degradation at different temperature. MEMS pressure sensors using Polysilicon and Graphene piezo resistive materials were simulated on silicon (100) substrate by COMSOL Multiphysics 5.3a version. The simulation result shows that at room temperature polysilicon pressure sensor performs well with pressure sensitivity of 3.81 mV/psi as well as it is found that graphene pressure sensor also shows better results at room temperature showing a pressure sensitivity of 3.98 mV/psi. As on frequently increasing the temperature it is noticed that polysilicon pressure sensitivity degrades with a factor of 0.64 mV/psi. However, graphene pressure sensor shows very less variation in sensitivity at higher temperature. Although it shows a small increment of 0.02 mV/psi in the pressure sensitivity. This analysis opens the path to utilise the graphene pressure sensor at high temperature.
机译:MEMS压力传感器在2018年期间出现了卓越的收益变化。由于近期智能微系统技术的自动化系统的增长,传感器的需求大幅增加。高灵敏度,灵活性,小型化和散装生产是压力传感器在MEMS市场的新高度方面的一些关键因素。在本文中,已经分析了石墨烯压电电阻材料,用于压力传感元件,并与多晶硅在不同温度下的灵敏度和传感器性能下降方面进行比较。 MEMS通过COMSOL Multiphysics 5.3A版本在硅(100)基板上模拟了使用多晶硅和石墨烯压电材料的压力传感器。仿真结果表明,在室温下,多晶硅压力传感器在3.81mV / psi的压力灵敏度下进行良好,并且发现石墨烯压力传感器在室温下也显示出较好的结果,显示为3.98mV / psi的压力敏感性。由于经常增加温度,因此注意到多晶硅压力敏感性较小,因子为0.64mV / psi。然而,石墨烯压力传感器在较高温度下表示敏感性的变化非常较小。虽然它在压力灵敏度下显示出0.02 mV / psi的小增量。该分析打开了在高温下使用石墨烯压力传感器的路径。

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