Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology

摘要

In this article, a novel planar helix traveling wave tube structure is proposed for S/X-band amplification. The planar helix structure is developed between two printed circuit boards such that they utilize solder balls to connect each other. This technique which comes originally from microelecronic packaging technology called ball grid array. To evaluate the performance of the proposed structure, one period of its geometry is modeled and the cold test parameters are calculated in CST microwave studio(TM). The fundamental space harmonic mode overlaps well with the beam-line in the dispersion diagram for both bands. The in- and out-coupler ports are also designed in the form of coplanar waveguides having good matching. For 150 periods of the planar helix, the 15 dB gain is obtained in particle-in-cell simulations for both bands. Finally, the fabrication process is implemented and the cold test is done.