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首页> 外文期刊>Materials science in semiconductor processing >Electrical properties and B depth profiles of in-situ B doped Si films grown by ECR Ar plasma CVD without substrate heating
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Electrical properties and B depth profiles of in-situ B doped Si films grown by ECR Ar plasma CVD without substrate heating

机译:ECR AR等离子CVD的原位B掺杂Si薄膜的电气性能和B深度剖面,无基质加热

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摘要

In-situ B doping in epitaxial and amorphous Si films was investigated by low-energy electron-cyclotron resonance (ECR) Ar plasma chemical vapor deposition (CVD) by using SiH4 and B2H6 without substrate heating. For a B-doped epitaxial Si film, high carrier concentration of 7.1x10(19) cm(-3) with Hall mobility of 19 cm(2) V-1 s(-1) was measured at room temperature. Moreover, good rectifying characteristics was obtained for a Si p+/n junction diode. Especially for exploration of a heavily B-doped Si film, depth profiling results show that B concentration tends to be smaller near the initial substrate surface. Finally, effective control of B segregation by atomic-order B pre-deposition or by Si buffer deposition on initial Si(100) has been demonstrated to achieve heavy B doping in whole region of deposited Si film.
机译:通过使用SiH4和B2H6的低能量电子 - 回答(ECR)AR等离子体化学气相沉积(CVD)研究了在外延和非晶Si膜中的原位B掺杂,没有底物加热。 对于B掺杂的外延Si薄膜,在室温下测量高型载体浓度为19cm(2)V-1s(-1)的霍尔迁移率。 此外,获得了Si P + / N结二极管的良好整流特性。 特别是对于探索重掺杂的Si膜,深度分析结果表明,B浓度倾向于在初始衬底表面附近更小。 最后,已经证明了通过原子阶B预沉积或通过Si缓冲沉积对B次沉积的有效控制,以在沉积的Si膜的整个区域中实现重的B掺杂。

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