Reworkable Edgebond Adhesive Enhances Board Level Reliability of Area Array Packages

摘要

A new approach to enhancing the board level reliability of area array packages was presented. John McMahon, et. al. presented work, performed at Celestica, that demonstrates that a reworkable edgebond adhesive, manufactured by Zymet, takes a 55 mm LTCC CBGA out to more than 3,000 cycles of 0°C to 100°C cycling without failure, a dramatic improvement over a non-reinforced component.