PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE WHICH REPLACES A BALL GRID ARRAY SUBSTRATE AND IMPROVES BOARD LEVEL RELIABILITY AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board for semiconductor package which improves board level reliability and a manufacturing method thereof are provided to prevent a disconnection of a circuit by relatively broadening a half etching region.;CONSTITUTION: A first etching part and a bump are etched in one side of a conductive base substrate. A filling part is filled with an insulating material. A second etching part and a circuit pattern (150) are etched in the other side of the conductive base substrate. A first solder resist layer (160) exposes the bump. A second solder resist layer (170) is formed on the second etching part and the circuit pattern.;COPYRIGHT KIPO 2013