首页> 外文OA文献 >Special Articles: The Problem of Evaluation of Insulation Reliability for Printed Circuit Boards. Measurement Techniques of Dielectric Characteristics Suitable for Electrical Insulating Materials Used for Printed Circuit Boards and Their Application to the Estimation of Reliability on Insulation Properties.

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Special Articles: The Problem of Evaluation of Insulation Reliability for Printed Circuit Boards. Measurement Techniques of Dielectric Characteristics Suitable for Electrical Insulating Materials Used for Printed Circuit Boards and Their Application to the Estimation of Reliability on Insulation Properties.

机译：特殊文章：印刷电路板绝缘可靠性评价问题。适用于用于印刷电路板的电绝缘材料的介电特性的测量技术及其在绝缘性能估计的应用中的应用。

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Eiki WATANABE;
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年度 1995
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1. Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material [J] . Zhixing Sun, Zhigang Shen, Shulin Ma, Journal of Materials Engineering and Performance . 2013,第10期

机译：从废印刷电路板回收的玻璃纤维作为隔音材料的新应用
2. Effect of Different Surface Finishes on Bending Reliability of the Rigid Printed Circuit Board and Flexible Printed Circuit Board Substrate Joints with the Transverse Ultrasonic Bonding Process [J] . Lee Jong Gun, Lee Jong-Bum, Kim Sang-Woo, Nanoscience and Nanotechnology Letters . 2019,第6期

机译：不同表面对横向超声波粘接工艺刚性印刷电路板弯曲可靠性的影响及柔性印刷电路板基座接头
3. Electrical Insulation of Conformally Coated Printed Circuit Boards: An Overview and a Study of the Influence of Pollution [J] . Zeynali Ehsan, Bridges Ryan, Kordi Behzad IEEE Electrical Insulation Magazine . 2021,第2期

机译：集合涂层印刷电路板的电绝缘：概述和污染影响的研究
4. Study on the Insulation Reliability Model of Printed Circuit Boards Under Continuous Square Impulse Voltage [C] . Taotao Xiong, Quan Zhou, Xi Ouyang, IEEE International Conference on High Voltage Engineering and Application . 2018

机译：连续方形脉冲电压下印刷电路板绝缘可靠性模型的研究
5. A virtual predictive environment for monitoring reliability, life time, and maintainability of printed circuit boards. [D] . Dababneh, Amer Basheer. 2013

机译：一个虚拟的预测环境，用于监视印刷电路板的可靠性，寿命和可维护性。
6. Partial Discharge Characteristics of Polymer Nanocomposite Materials in Electrical Insulation: A Review of Sample Preparation Techniques Analysis Methods Potential Applications and Future Trends [O] . Wan Akmal Izzati, Yanuar Z. Arief, Zuraimy Adzis, -1

机译：聚合物纳米复合材料在电绝缘中的局部放电特性：样品制备技术分析方法潜在应用和未来趋势的综述
7. Special Articles: The Problem of Evaluation of Insulation Reliability for Printed Circuit Boards. Evaluation of Electric Insulation of PCB. [O] . Yoshikuni TANIGUCHI 1995

机译：特殊文章：印刷电路板绝缘可靠性评价问题。 PCB电绝缘的评价。
8. THE APPLICATION OF NUCLEAR TECHNIQUES TO THE MANUFACTURE OF HIGH-RELIABILITY PRINTED CIRCUIT BOARDS [R] . L J. Wright, J. B. Fishman, C. E. Smedley 1963

机译：核技术在高可靠性印刷电路板制造中的应用

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