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首页> 外文期刊>Advanced Science, Engineering and Medicine >Effect of Annealing on the Characteristics of TiO_2 Thin Film Deposited by Low Temperature Arc Vapor Deposition Process
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Effect of Annealing on the Characteristics of TiO_2 Thin Film Deposited by Low Temperature Arc Vapor Deposition Process

机译:退火对低温电弧气相沉积TiO_2薄膜特性的影响

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摘要

The TiO_2 thin films, deposited by Low Temperature Arc Vapor Deposition (LTAVD) process on n type Si<100> substrate, have been investigated for structural, morphological, electrical and optical properties. The effect of annealing on the properties of the films has also been studied. The deposited film was amorphous in nature and was subsequently found to be converted to anatase polycrystalline nature following annealing. The deposited TiO_2 thin film was n-type in nature and its resistivity was found to increase with the increase in temperature in O_2 atmosphere. The carrier concentration of the films was of the order of 10~(17) /cm~3. The direct bandgap was estimated to be 3.47 eV from the results of PL study. A good quality polycrystalline anatase TiO_2 film suitable for thin-film devices was successfully obtained by LTAVD process.
机译:已经研究了通过低温电弧气相沉积(LTAVD)工艺在n型Si <100>衬底上沉积的TiO_2薄膜的结构,形态,电学和光学性质。还研究了退火对薄膜性能的影响。沉积的膜本质上是无定形的,随后发现在退火后会转变为锐钛矿多晶性。沉积的TiO_2薄膜本质上是n型的,并且发现其电阻率随着O_2气氛中温度的升高而增加。薄膜的载流子浓度约为10〜(17)/ cm〜3。根据PL研究的结果,直接带隙估计为3.47 eV。通过LTAVD工艺成功获得了适用于薄膜器件的高质量多晶锐钛矿型TiO_2薄膜。

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