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The Investigation of Field Plate Design in 500V High Voltage NLDMOS

机译:500V高压NLDMOS场板设计的研究

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摘要

This paper presents a 500V high voltage NLDMOS with breakdown voltage (V-BD) improved by field plate technology. Effect of metal field plate (MFP) and polysilicon field plate (PFP) on breakdown voltage improvement of high voltage NLDMOS is studied. The coeffect of MFP and PFP on drain side has also been investigated. A 500V NLDMOS is demonstrated with a 37 mu m drift length and optimized MFP and PFP design. Finally the breakdown voltage 590V and excellent on-resistance performance (R-sp = 7.88 ohm * mm(2)) are achieved.
机译:本文提出了一种通过场板技术改进的具有击穿电压(V-BD)的500V高压NLDMOS。研究了金属场板(MFP)和多晶硅场板(PFP)对改善高压NLDMOS击穿电压的影响。还研究了MFP和PFP在排水侧的协同效应。演示了500V NLDMOS,漂移长度为37μm,并优化了MFP和PFP设计。最终实现了590V的击穿电压和出色的导通电阻性能(R-sp = 7.88 ohm * mm(2))。

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