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Amorphous SixGeyO1-x-y thin films for uncooled infrared microbolometers

机译:用于未冷却红外微致氢仪的无定形六币1-X-Y薄膜

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摘要

This paper presents a detailed characterization of Silicon Germanium Oxide (SixGeyO1-x-y) thin films for uncooled infrared microbolometers. The films were prepared by RF magnetron sputtering using simultaneous deposition from silicon and germanium targets in an argon and oxygen environment. The electrical properties of the films were studied as a function of oxygen (up to 10%) and silicon (up to 30%). The results demonstrated that a high temperature coefficient of resistance (TCR) and a low corresponding resistivity can be achieved using various compositions, for example, Si0.054Ge0.877O0.069 films have achieved a TCR and a resistivity of - 3.5 %/K and 629 Omega-cm, respectively. X-ray diffraction (XRD) demonstrated that the films are amorphous, and the broadening of XRD spectra (full width at half maximum, FWHM) is related to the decrease and increase of TCR and resistivity, for example, oxygen and fixed Si concentrations of 6.16% and 4% result in narrow spectra which corresponds to a higher TCR value of - 3.6 %/K. The Fourier transform infrared spectroscopy (FTIR) study shows that the absorption peaks corresponding to Ge-O and Si-O are located around 800 cm(-1) and 960 cm(-1), respectively. The peak intensity of Si-O increases as the Si content increases while Ge-O bond disappears as the Si content increases above 6%. These results are used to explain the TCR and resistivity behavior as the Si concentration increased in the film. In addition, the chemical bonding between Ge-Ge and Ge-Si, measured using the Raman spectroscopy study demonstrates that at a fixed oxygen concentration of 4%, The peak shift of Ge-Ge and Ge-Si are relatively small which corresponds to a small change in TCR and resistivity at this Si concentration range, while at oxygen concentration of 8%, the Ge-Si bond have more effects on increasing TCR values, and the larger peak shift corresponds to a higher TCR values.
机译:本文介绍了用于未冷却红外微血管仪的氧化硅锗(Sixgeyo1-X-Y)薄膜的详细表征。通过在氩气和氧环境中使用来自硅和锗靶的同时沉积,通过RF磁控溅射制备薄膜。研究了薄膜的电性能作为氧气(高达10%)和硅(最多30%)的函数。结果表明,使用各种组合物可以实现高温抗性系数(TCR)和低相应的电阻率,例如,Si0.054Ge0.877O0.069薄膜已经实现了TCR和3.5%/ K的电阻率和电阻率分别为629欧米加厘米。 X射线衍射(XRD)证明薄膜是无定形的,并且XRD光谱(全宽为半最大,FWHM)与TCR和电阻率的降低有关,例如氧气和固定的Si浓度有关6.16%和4%导致窄光谱,其对应于较高的TCR值 - 3.6%/ k。傅里叶变换红外光谱(FTIR)研究表明,对应于GE-O和Si-O的吸收峰分别位于800cm(-1)和960cm(-1)约。随着Si含量的增加,随着Si含量的增加,Si含量随着Si含量的增加而增加,Si-O的峰强度增加。随着薄膜中的Si浓度增加,这些结果用于解释TCR和电阻率行为。另外,使用拉曼光谱研究测量的Ge-Ge和Ge-Si之间的化学键键合,在固定的氧浓度为4%,Ge-Ge和Ge-si的峰值相对较小,这对应于a在该Si浓度范围内的TCR和电阻率的小变化,而在氧浓度为8%时,Ge-Si键对增加TCR值具有更多的影响,并且较大的峰值偏移对应于更高的TCR值。

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