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Amorphous Silicon Thin-Films for Uncooled Infrared Microbolometer Sensors

机译:非晶硅薄膜,用于非冷却型红外微辐射热传感器

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An important application of thin-film hydrogenated amorphous silicon (α-Si:H) is infrared detection and imaging with microbolometer focal plane arrays. Key α-Si:H electrical transport properties that influence detector design and performance are resistivity and temperature coefficient of resistance (TCR). These properties have been measured over a wide temperature range for p- and n-type doped α-Si:H thin-films deposited by plasma enhanced chemical vapor deposition using silane as a precursor gas. Resistivity near and above room temperature follows an Arrhenius thermally activated dependence. At low temperatures, resistivity transitions from Arrhenius behavior to a variable range hopping mechanism described by the Mott relation and TCR changes at a slower rate than predicted by thermally activated transport alone. Resistivity and TCR are affected by doping and film growth parameters such as dilution of the silane precursor with hydrogen. Resistivity decreases with dopant concentration for both p-type and n-type dopants. Resistivity and TCR increase with hydrogen dilution of silane. TCR and resistivity are interrelated and optimization of thin-film preparation and processing is necessary to obtain high TCR with resistivity values compatible with readout integrated circuit designs. Such optimization of transport properties of α-Si:H films has been applied to the development of high performance ambient operating temperature (uncooled) microbolometer arrays.
机译:薄膜氢化非晶硅(α-Si:H)的重要应用是利用微辐射热计焦平面阵列进行红外检测和成像。影响探测器设计和性能的关键α-Si:H电传输特性是电阻率和电阻温度系数(TCR)。对于通过使用硅烷作为前驱体气体的等离子体增强化学气相沉积法沉积的p型和n型掺杂α-Si:H薄膜,已在较宽的温度范围内测量了这些性能。接近或高于室温的电阻率遵循Arrhenius热激活依赖性。在低温下,电阻率从Arrhenius行为过渡到由Mott关系描述的可变范围跳变机制,而TCR的变化速率要比单独的热活化传输所预测的慢。电阻率和TCR受掺杂和膜生长参数(例如硅烷前体被氢稀释)的影响。对于p型和n型掺杂剂,电阻率都随着掺杂剂浓度的降低而降低。电阻率和TCR随着硅烷的氢稀释而增加。 TCR和电阻率是相互关联的,要获得电阻率值与读出集成电路设计兼容的高TCR,必须优化薄膜制备和工艺。这种对α-Si:H薄膜传输性能的优化已被应用于高性能环境工作温度(非冷却)微辐射热计阵列的开发。

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