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Silicone-free thermally conductive paste

机译:无硅导热膏

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摘要

Robnor Resins TCP091 is the name of a silicone-free paste developed by Robnor Resins that provides efficient heat transfer across the interface between electronic components. Its use is recommended wherever efficient and reliable heat transfer or heat dissipation between any surfaces is required, without the contamination associated with silicone-based products.
机译:Robnor Resins TCP091是Robnor Resins开发的不含有机硅的糊剂的名称,可在电子组件之间的界面上提供有效的热传递。建议在需要有效和可靠地在任何表面之间进行热传递或散热的情况下使用,而不会污染有机硅基产品。

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