Thermally conductive composition and thermally conductive paste

摘要

Provided is a thermally conductive composition which is free from concern of low molecular weight siloxane, can be highly filled with thermally conductive filler, is easy to handle at normal temperature and softens at use temperature. A heat conductive composition comprising a phase change material having a melting point of from 35 C. to 120 C., a binder comprising a nonionic surfactant and a nonvolatile component, and a thermally conductive filler, wherein 100 parts by mass of the binder 10 parts by mass or more of the phase change material occupied, 60 parts by mass or more of the nonionic surfactant and 30 parts by mass or less of the nonvolatile component. According to this thermally conductive composition, it is solid at room temperature and excellent in handling property, softened and melted in actual use, adhered to the adherend, and thermal resistance can be lowered. BACKGROUND OF THE INVENTION