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An Analysis of On-Chip Interconnection Networks for Large-Scale Chip Multiprocessors

机译:大型芯片多处理器的片上互连网络分析

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With the number of cores of chip multiprocessors (CMPs) rapidly growing as technology scales down, connecting the different components of a CMP in a scalable and efficient way becomes increasingly challenging. In this article, we explore the architectural-level implications of interconnection network design for CMPs with up to 128 fine-grain multithreaded cores. We evaluate and compare different network topologies using accurate simulation of the full chip, including the memory hierarchy and interconnect, and using a diverse set of scientific and engineering workloads.
机译:随着技术的缩减,芯片多处理器(CMP)的核心数量迅速增长,以可扩展和高效的方式连接CMP的不同组件变得越来越具有挑战性。在本文中,我们探讨了具有多达128个细粒度多线程内核的CMP互连网络设计在体系结构级别上的意义。我们使用完整芯片的精确仿真(包括内存层次结构和互连)以及各种科学和工程工作量,来评估和比较不同的网络拓扑。

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