机译:3D芯片堆叠低温粘合的材料,加工和可靠性
Jiangsu Normal Univ Sch Mechatron Engn Xuzhou 221116 Peoples R China;
Chinese Acad Sci Inst Met Res Shenyang 110016 Liaoning Peoples R China;
Natl Tsing Hua Univ Dept Chem Engn Hsinchu Taiwan;
Intel Corp 5000W Chandler Blvd Phoenix AZ 85226 USA;
Zhengzhou Res Inst Mech Engn State Key Lab Adv Brazing Filler Met &
Technol Zhengzhou 450001 Henan Peoples R China;
Jiangsu Normal Univ Sch Mechatron Engn Xuzhou 221116 Peoples R China;
Jiangsu Normal Univ Sch Mechatron Engn Xuzhou 221116 Peoples R China;
Jiangsu Normal Univ Sch Mechatron Engn Xuzhou 221116 Peoples R China;
Jiangsu Normal Univ Sch Mechatron Engn Xuzhou 221116 Peoples R China;
3D IC; Low temperature bonding; Bonding method; Reliability;
机译:3D芯片堆叠低温粘合的材料,加工和可靠性
机译:通过混合低温工艺实现堆叠3D MEMS的晶圆级键合和直接电互连
机译:15μm节距的Cu / Au互连依靠自对准的低温热超声倒装芯片键合技术来实现高级芯片堆叠应用
机译:开发具有30μm节距的无铅焊料微凸点的3DIC芯片堆叠的无助焊剂晶圆上键合工艺和可靠性表征
机译:通过低温芯片对晶圆键合将铟镓砷MSM阵列与硅平台进行3D集成。
机译:晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
机译:平行间隙粘合法的粘接部件温度升高和粘接机构。粘接现象和尺寸第二次报告电子材料的过程控制。