Towards achieving nanofinish on silicon (Si) wafer by -wire electro-discharge machining (vol 99, pg 3005, 2018)

Jarin Sams; Saleh Tanveer; Muthalif Asan G. A.; Ali Mohammad Yeakub; Bhuiyan Moinul

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Towards achieving nanofinish on silicon (Si) wafer by -wire electro-discharge machining (vol 99, pg 3005, 2018)

机译：通过壁电放电加工（Vol 99，PG 3005,2018）在硅（Si）晶圆上实现纳米型（Si）晶圆

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来源
《The International Journal of Advanced Manufacturing Technology》 |2019年第8期|共1页
作者
Jarin Sams; Saleh Tanveer; Muthalif Asan G. A.; Ali Mohammad Yeakub; Bhuiyan Moinul;
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作者单位

Int Islamic Univ Malaysia Fac Engn Kuala Lumpur Wilayah Perseku Malaysia;

Int Islamic Univ Malaysia Fac Engn Kuala Lumpur Wilayah Perseku Malaysia;

Int Islamic Univ Malaysia Fac Engn Kuala Lumpur Wilayah Perseku Malaysia;

Int Islamic Univ Malaysia Fac Engn Kuala Lumpur Wilayah Perseku Malaysia;

Int Univ Scholars Sch Sci &

Engn Dhaka Bangladesh;

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原文格式 PDF
正文语种 eng
中图分类自动化装置与设备;
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1. Towards achieving nanofinish on silicon (Si) wafer by -wire electro-discharge machining (vol 99, pg 3005, 2018) [J] . Jarin Sams, Saleh Tanveer, Muthalif Asan G. A., The International Journal of Advanced Manufacturing Technology . 2019,第5a8期

机译：通过壁电放电加工（Vol 99，PG 3005,2018）在硅（Si）晶圆上实现纳米型（Si）晶圆
2. Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining [J] . Sams Jarin, Tanveer Saleh, Asan G. A. Muthalif, The International Journal of Advanced Manufacturing Technology . 2018,第9a12期

机译：通过μ-丝电放电加工实现硅（Si）晶片上的纳米型（Si）晶片
3. Novel low-cost alkaline texturing process for diamond wire-sawn industrial monocrystalline silicon wafers (vol 185, pg 406, 2018) [J] . Basu Prabir Kanti, Sreejith K. P., Yadav Tarun S., Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion . 2019,第期

机译：钻石线锯工业单晶硅晶圆晶晶晶圆的新型低成本碱性纹理过程（Vol 185，PG 406,2018）
4. FINITE ELEMENT MODELING OF TEMPERATURE DISTRIBUTION AND OPTIMIZATION TO AVOID WIRE BREAKAGE IN WIRE ELECTRO-DISCHARGE MACHINING [C] . S. Saha, M. Pachon, A. Ghoshal International Congress on Thermal Stresses and Related Topics . 2003

机译：温度分布和优化的有限元建模，避免电线电放电加工线断裂
5. An investigation of wire electrical discharge machining (WEDM) of p-doped elemental semiconductors for wafer slicing and high-aspect-ratio microfabrication. [D] . Rakwal, Dinesh. 2009

机译：对用于晶片切片和高纵横比微加工的p掺杂元素半导体的电火花线切割加工（WEDM）的研究。
6. Surface Modification Using Assisting Electrodes in Wire Electrical Discharge Machining for Silicon Wafer Preparation [O] . Chunliang Kuo, Yupang Nien, Anchun Chiang, 2021

机译：用于硅晶片制备线电放电加工中的辅助电极表面改性
7. Correction to: Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining [O] . Sams Jarin, Tanveer Saleh, Asan G. A. Muthalif, 2018

机译：校正：通过μ导线电放电加工实现在硅（Si）晶片上实现纳米物质
8. Fabrication and Electrical Characterization of Multilevel Aluminum Interconnects Used to Achieve Silicon-Hybrid Wafer-Scale Integration [R] . Takahashi, G. L. 1987

机译：用于实现硅混合晶圆级集成的多层铝互连的制作和电气特性

Towards achieving nanofinish on silicon (Si) wafer by -wire electro-discharge machining (vol 99, pg 3005, 2018)

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