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Texture and morphology developments of Yttria-stabilized zirconia (YSZ) buffer layer for coated conductors by RF sputtering

机译:射频溅射氧化钇稳定氧化锆(YSZ)缓冲层用于涂层导体的织构和形貌发展

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摘要

Yttria-stabilized zirconia (YSZ) films are deposited on CeO_2/NiW tapes by RF sputtering for (Gd) BCO-coated conductors. Surface morphology and texture developments are investigated as the O_2:Ar ratio and sputtering power increase. Both the grain size and the roughness of YSZ films increase as sputtering power increases. A simple model proposed by Bartelt et al. is used to explain the results. The strain relaxation mechanism plays a major role in the sudden increase in roughness for YSZ film deposited at a sputtering power of 50W. It is observed that low O_2:Ar ratio favors the growth of (200) orientation for YSZ film, while high O_2:Ar ratio favors the growth of (111) orientation. The preferential orientation (200) of the YSZ film with low O_2:Ar ratio arises from template effect of CeO_2 buffer layer. The (111) orientation of YSZ film with high O_2:Ar ratio is due to thermodynamic mechanism aiming for the lowest surface energy. The grain size and roughness of our optimal YSZ film are 10-15nm and 0.7nm, respectively. The out-of-plane texture of our optimal YSZ film is 4.05°. The in-plane texture is 6.35°. The plan view and cross-section SEM images of YSZ films on CeO_2/NiW tapes show a flat, dense and no micro-cracks morphology. Based on these results, (Gd) BCO films are deposited by RF sputtering, achieving self-field J_c of 4.0 MA/cm2 at 77K.
机译:通过RF溅射将氧化钇稳定的氧化锆(YSZ)膜沉积在CeO_2 / NiW带上,以涂覆(Gd)BCO涂层的导体。随着O_2:Ar比和溅射功率的增加,研究了表面形态和织构的发展。 YSZ薄膜的晶粒尺寸和粗糙度都随溅射功率的增加而增加。 Bartelt等人提出的一个简单模型。用于解释结果。应变松弛机制在以50W溅射功率沉积的YSZ膜的粗糙度突然增加中起主要作用。观察到低的O_2:Ar比有利于YSZ薄膜的(200)取向生长,而高的O_2:Ar比有利于(111)取向的生长。低O_2:Ar比的YSZ薄膜的优先取向(200)是由CeO_2缓冲层的模板效应引起的。具有高O_2:Ar比的YSZ膜的(111)取向归因于旨在获得最低表面能的热力学机制。我们最佳的YSZ薄膜的晶粒尺寸和粗糙度分别为10-15nm和0.7nm。我们最佳的YSZ膜的面外纹理为4.05°。面内纹理为6.35°。 CeO_2 / NiW胶带上的YSZ薄膜的平面图和横截面SEM图像显示出平坦,致密且无微裂纹的形态。根据这些结果,通过RF溅射沉积(Gd)BCO膜,在77K时实现4.0 MA / cm2的自电场J_c。

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